Buffers

 Electroless nickel plating process buffered lactic acid hydrogen ions, the pH value of the solution in the plating process with reduced gradually, in order to stabilize the coating deposition rate and quality assurance, electroless nickel plating system must have the PH value of buffer capacity, that is so that in the applied Plating of the pH will not change too much, can be maintained at a pH value within the normal range. Some weak acid (or base) and its salts can be offset by a mixture consisting of a little alien and dilute acid or alkali solution pH on the impact of changes to magnessium lactate in a smaller range of fluctuation, a substance called a buffer. Bad cushioning buffer pH and acid concentration can change map to said acid concentration in the certain range and the pH buffering system is basically the same performance.

    Electroless nickel solution commonly used in mono-or dicarboxylic acids and their salts complexed nickel ions not only have the ability, but also has cushioning properties. In acidic plating bath used HAC-NaAC system have good cushioning performance, but acetate complexing ability is very small, it is generally not a complexing agent used.